Heat conduction

We at Tribotec have extensive experience with heat conduction materials, and helping our customers with heat dissipation in electronics. Heat conduction material based on silicone has great advantages, including that the material has a very low surface tension and can therefore provide maximum contact surface with the hot part. Precisely the wetting property is decisive for obtaining a high total heat dissipation.

We provide three types of technology for heat dissipation in electronics: potting using potting compound, gluing heat sinks with heat-conducting glue, and grease as a heat transfer agent between heating element and heat sink.

Electronic silicone for heat conduction

Momentive RTV 627 Silicone 2-component

2-component silicone rubber for encapsulation and encapsulation of electronic components. Easy flowing,…

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Momentive TIA 208R thermally conductive silicone, UL rated

2-component, heat-conducting silicone for casting and gap filling. Cures at room temperature…

Momentive TIA 208R thermally conductive silicone, UL rated
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Momentive Snapsil TN 3085 Heat-conducting Silicone, 1-component, UL-classified

1-component, thermally conductive, low-volatility siloxane that cures at room temperature using…

Momentive silicone, cartridge
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